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QFN FOW Packaging
The FOW (film on wire) stacking process has advantages of high reliability, compact structure, low cost, strong flexibility, and high performance, which can be used in various applications, ...
QFN/DFN Packaging
QFN, (Quad Flat No lead Package), can be applied in various fields such as computer, communication, consumer electronics, electrics cars. It is a packaging technology that with broad prospects.
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